Nanocrystalline materials for high temperature soft magnetic applications: a current prospectus

Bulletin of Materials Science

Volumn 22, Issue 3, 1999, Pages 495-501

  McHenry, M E ^a   Willard, M A ^a   Iwanabe, H ^a,b   Sutton, R A ^a,c   Turgut, Z ^a   Hsiao, A ^a   Laughlin, D E ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b Japan Electric Corporation   (Japan)

^c UNIVERSITY OF QUEENSLAND   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

COERCIVE FORCE; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HIGH TEMPERATURE APPLICATIONS; MAGNETIC PROPERTIES; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS;

CURIE TEMPERATURES; SOFT FERROMAGNETIC PROPERTIES;

SOFT MAGNETIC MATERIALS;

EID: 0033334862     PISSN: 02504707     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02749961     Document Type: Article

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