Effect of Au-intermetallic compounds on mechanical reliability of Sn-Pb/Au-Ni-Cu joints

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Zribi, A ^a   Chromik, R R ^a   Presthus, R ^a   Clum, J ^a   Zavalij, L ^a   Cotts, E J ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COMPOSITION EFFECTS; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; GOLD ALLOYS; INTERFACES (MATERIALS); INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; SOLDERED JOINTS; SUBSTRATES; TIN ALLOYS;

OPTICAL METALLOGRAPHY; SOLDER-PAD METALLIZATION LEVELS;

ELECTRONICS PACKAGING;

EID: 0033334193     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Anhöck, S., Oppermann, H., Kallmayer, C., Aschenbrenner, R., Thomas, L., Reichl, H., "Investigations of Au/Sn alloys on different end-metallizations for high temperature applications" IEEE/CPMT Electronics Manufacturing Technology Symposium, 1998, p. 156-165.
2. Chromik, R. R., "The Thermodynamics and Kinetics of Solid State Reactions In The Pd-Sn System", Masters Thesis SUNY at Binghamton, 1996.
3. Ferguson, M. E., Fieselman, C.D., Elkins, M.A., "Manufacturing Concerns When Soldering with Au Plated Component Leads or Circuit Board Pads", IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part C, Vol. 20, No. 3, July 1997, p. 186-193.
4. Kim, H. K., Liou, H.K., Tu, K.N, "Morphology of instability of the wetting tips of eutectic SnBi, eutectic Sn-Pb, and pure Sn on Cu", Materials Research Society, Vol. 10, No.3, July 1994, p.497- 504.
5. Kim, P.G. and Tu, K.N., "Fast Soldering Reactions On Au Foils", Materials Research Society, Vol.445, 1997, p. 131-136.
6. Kramer, P.A., Glazer, J., Morris, J.W., Jr., "The Effect of Low Au Concentrations on the Creep of Eutectic Sn-Lead Joints", Metallurgical and Materials Transactions A, Vol.25A, June 1994, p. 1249-1255.
7. Mei, Z., Kaufmann, M., Eslambolchi, A., Johnson, P., "Brittle Interfacial Fracture of PBGA Packages Soldered on Electroless Ni/Immersion Au", 1998 Proceedings of the 48th Electronic Components and Technology Conference 1998, p. 952-961.
8. Nakahara, S., McCoy, R.J., Buene, L., Vandenberg, J.M., "Room Temperature Interdiffusion Studies Of Au/Sn Thin Film Couples", Thin Solid Films, No. 84, (1981), p. 185-196.
9. Ohriner, E. K., "Intermetallic Formation in Soldered Copper-Based Alloys at 150°C to 250°C", Welding Journal: Research suppliment, July 1987, p.191s/202s.