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Volumn 3884, Issue , 1999, Pages 278-289
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Process and yield improvement based on fast in-line automatic defect classification
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Author keywords
[No Author keywords available]
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Indexed keywords
AUTOMATION;
DEFECTS;
FAILURE ANALYSIS;
INSPECTION;
PROCESS CONTROL;
PRODUCTIVITY;
SAMPLING;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTOR DEVICE MANUFACTURE;
DEFECT REDUCTION;
EXCURSION MONITORING;
IN-LINE AUTOMATIC DEFECT CLASSIFICATION;
SMART SAMPLING;
THROUGHPUT DEFECT REVIEW;
WAFER INSPECTION;
YIELD ENHANCEMENT;
SILICON WAFERS;
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EID: 0033333132
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (16)
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References (8)
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