Optical full-field technique for measuring deflection and strain on micromechanical components

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3875, Issue , 1999, Pages 50-60

  Aswendt, Petra ^a   Hoefling, Roland ^a   Hiller, Karla ^a  

^a FRAUNHOFER INSTITUTE FOR MACHINE TOOLS AND FORMING TECHNOLOGY IWU   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; DEFORMATION; GYROSCOPES; INTERFEROMETRY; MECHANICAL VARIABLES MEASUREMENT; MICROMACHINING; MICROSCOPIC EXAMINATION; MICROSENSORS; MULTILAYERS; OPTICAL RESOLVING POWER; STRAIN; VIBRATIONS (MECHANICAL);

DEFLECTION; MICROELECTROMECHANICAL SYSTEM TESTING; OPTICAL FULL FIELD TECHNIQUE; SPECKLE INTERFEROMETRY;

MICROELECTROMECHANICAL DEVICES;

EID: 0033332194     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)