High resolution coplanar structures on multilayer LTCC for applications up to 40 GHz

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 79-83

  Kulke, R ^a   Rittweger, M ^a   Simon, W ^a   Wien, A ^a   Wolff, I ^a  

^a Inst of Mobile and Satellite   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FIRING (OF MATERIALS); INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; METALLIZING; MULTICHIP MODULES; MULTILAYERS; SCREEN PRINTING; STRUCTURE (COMPOSITION);

HIGH RESOLUTION COPLANAR STRUCTURE; LOW TEMPERATURE COFIRED CERAMICS;

CERAMIC MATERIALS;

EID: 0033328209     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)