High Frequency Characterization of a Chip Scale BGA Package

Asia-Pacific Microwave Conference Proceedings, APMC

Volumn , Issue , 1999, Pages 966-970

  Yeo, Yong Kee ^a   Iyer, Mahadevan K ^a   Qiu, Youlin ^a   Leong, Mook Seng ^b   Ooi, Ban Leong ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; CHIP SCALE PACKAGES; PACKAGING; ELECTROMAGNETIC FIELD THEORY; FREQUENCY DOMAIN ANALYSIS; MATHEMATICAL MODELS; SPURIOUS SIGNAL NOISE;

BGA PACKAGE; CHARACTERISTIC-FREQUENCY; CHIP-SCALE; CHIP-SCALE PACKAGE; ELECTRICAL CHARACTERISTIC; FREQUENCY BEHAVIOR; FULL WAVES; HIGH FREQUENCY HF; HIGH-FREQUENCY CHARACTERIZATION; SIMULATION MODEL;

FREQUENCY DOMAIN ANALYSIS; ELECTRONICS PACKAGING;

BALL GRID ARRAY (BGA); SIMULTANEOUS SWITCHING NOISE (SSN);

EID: 0033326730     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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