Conductive adhesive-free surface mount type high frequency fundamental crystal resonators by gold bump bonding

Proceedings of the Annual IEEE International Frequency Control Symposium

Volumn 1, Issue , 1999, Pages 461-464

  Iwata, Hirokazu ^a   Ishii, Osamu ^a  

^a Toyo Communication Equipment Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CERAMIC MATERIALS; GOLD; HEAT RESISTANCE;

GOLD BUMP BONDING;

CRYSTAL RESONATORS;

EID: 0033324840     PISSN: 01616404     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)