Future in-fab applications of total reflection X-ray fluorescence spectrometry for the semiconductor industry

Spectrochimica acta, Part B: Atomic spectroscopy

Volumn 54, Issue 10, 1999, Pages 1393-1398

  Iltgen, K ^a   Zschech, E ^a   Ghatak Roy, A ^b   Hossain, T ^b  

^a IBM MICROELECTRONICS   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; EMISSION SPECTROSCOPY; FLUORESCENCE; ION IMPLANTATION; LIGHT REFLECTION; NONDESTRUCTIVE EXAMINATION; RAPID THERMAL ANNEALING; SECONDARY ION MASS SPECTROMETRY; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SURFACE ROUGHNESS; X RAY SPECTROSCOPY;

CHEMICAL MECHANICAL POLISHING; TOTAL-REFLECTION X RAY FLUORESCENCE (TXRF) SPECTROMETRY;

SPECTROMETRY;

EID: 0033321473     PISSN: 05848547     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0584-8547(99)00096-8     Document Type: Article

References (8)

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