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Volumn 38, Issue 5 B, 1999, Pages 3312-3315
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Measurement of residual particles by high-intensity aerial ultrasonic waves
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Author keywords
Cleannes; High intensity aerial ultrasonic; Peeling off; Residual particles; Semiconductor manufacturing jigs; Surface cleaning; Waves
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Indexed keywords
PARTICLES (PARTICULATE MATTER);
SEMICONDUCTOR DEVICE MANUFACTURE;
ULTRASONIC WAVES;
AERIAL ULTRASONIC WAVES;
RESIDUAL PARTICLES;
ULTRASONIC CLEANING;
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EID: 0033320776
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.38.3312 Document Type: Article |
Times cited : (17)
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References (1)
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