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Volumn 38, Issue 5 B, 1999, Pages 3312-3315

Measurement of residual particles by high-intensity aerial ultrasonic waves

Author keywords

Cleannes; High intensity aerial ultrasonic; Peeling off; Residual particles; Semiconductor manufacturing jigs; Surface cleaning; Waves

Indexed keywords

PARTICLES (PARTICULATE MATTER); SEMICONDUCTOR DEVICE MANUFACTURE; ULTRASONIC WAVES;

EID: 0033320776     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.38.3312     Document Type: Article
Times cited : (17)

References (1)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.