Device and packaging considerations for MMIC-based millimeter-wave quasi-optical amplifier arrays

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3795, Issue , 1999, Pages 198-205

  Kolias, Nicholas J ^a   Kazior, Thomas E ^a   Chen, Yan ^a   Wright, Warren ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HIGH ELECTRON MOBILITY TRANSISTORS; INTEGRATED CIRCUIT LAYOUT; MILLIMETER WAVE DEVICES; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; THERMOANALYSIS;

BONDWIRE FREE INTERCONNECTS; DEVICE UNIFORMITY; DOUBLE SELECTIVE GATE RECESS; MILLIMETER WAVE QUASI OPTICAL AMPLIFIER ARRAYS;

LIGHT AMPLIFIERS;

EID: 0033320220     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.370164     Document Type: Conference Paper

References (7)