Defect reduction methodologies for damascene interconnect process development

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3883, Issue , 1999, Pages 96-105

  Skumanich, Andrew ^a   Cai, Man ping ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DEFECTS; INTERCONNECTION NETWORKS; PROCESS CONTROL; SCANNING ELECTRON MICROSCOPY;

DEFECT REDUCTION; WAFER INSPECTION; YIELD ENHANCEMENT;

INTEGRATED CIRCUIT LAYOUT;

EID: 0033319721     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.360575     Document Type: Conference Paper

References (6)