Strength of polysilicon for MEMS devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3880, Issue , 1999, Pages 40-44

  LaVan, David A ^a   Buchheit, Thomas E ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); FRACTURE TOUGHNESS; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; SILICON; STRAIN; STRESS CONCENTRATION; TENSILE STRENGTH; TENSILE STRESS; WEIBULL DISTRIBUTION;

NANOINDENTER; POLYSILICON;

MICROELECTROMECHANICAL DEVICES;

EID: 0033319639     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)