A complete methodology for electro-mechanical characterization of a CMOS Compatible MEMS Technology

IEICE Transactions on Electronics

Volumn E82-C, Issue 4, 1999, Pages 582-588

  Latorre, Laurent ^a   Nouet, Pascal ^a  

^a LIRMM   (France)

Author keywords

Analytical modeling; Characterization; Micro electro mechanical systems; Monolithic integration

Indexed keywords

CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT TESTING; MATHEMATICAL MODELS; MONOLITHIC INTEGRATED CIRCUITS; SENSORS; VLSI CIRCUITS;

ELECTROMECHANICAL CHARACTERIZATION; FORCE SENSORS;

MICROELECTROMECHANICAL DEVICES;

EID: 0033317730     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (17)

1. J.W. Gardner, "Microsensors Principles and Applications," Wiley, 1994 (ISBN: 0 471 91135 2).
2. H. Baltes, "1C MEMS Microtransducers," Proc. IEDM, pp.521-524, 1996.
3. H. Baltes, D. Moser, R. Lenggenlmger, O. Brand, and G. Wachutka, ''Thermomechanical microtransduccrs by CMOS technology combined with micromachining," Micro System Technologies 91, ed. Khran R & Reichl H, Berlin, pp.98-103, 1991.
4. K.E. Petersen, "Silicon as mechanical material," Proc. IEEE, vol.70, pp.420-457, 1982.
5. J.M. Karam, B. Courtois, and J.M. Paret, "Microelectronics compatible manufacturing techniques of microsystems," Mechatronics '96.
6. Y. Bertrand, P. Hazard, M. Labrunée, L. Latorre, P. Nonet, and F. Pressccq, "Characterization of a microsystem technology for space applications: Use and limitation of test vehicles," 2nd Round Table on Micro/Nano-Teclmologies for Space, Noorwyk, The Netherlands, pp.225-229, Oct. 15-17, 1997.
7. E.H. Yang and H. Fujita, "Fabrication and characterization of U-shaped beams for the determination of Young's modulus modification due to joule heating of polysilicon microstructures," Int. Conf. on Solid State Sensors and Actuators, pp.603-606, 1997.
8. I. Shimoyama, O. Kano, and H. Miura, "3D microstructures folded by Lorcntz force," Proc. IEEE MEMS'98, pp.24-28, 1998.
9. S.P. Timoshenko, "Strength of Materials," D. Van Nostrand -, Inc., Princeton, New Jersey, 1930.
10. B. Halg, "On a nonvolatile memory cell based on microelectro-mechanics," Proc. IEEE Micro Electro Mechanical Systems Workshop, eds. J.E. Wood and R.T. Howe, pp.172-176, Napa Valley, California, Feb. 11-14, 1990.
11. V. Mosser, J. Suski, J. Goss, and E. Obenncicr, "Piezoresistive pressure sensors based on polycrystalline silicon," Sensors and Actuators A, vol.28, pp.113-132, 1991.
12. J.Y.W. Seto, "Piezoresistive properties of polycrystalline silicon," J. Applied Physics, vol.47, no.ll, pp.4780-4783, 197G.
13. K. Hofmann, et al., "Generation of the HDL-A-model of a micromembrane from its finite-element-description," ED&TC'97, Paris, France, pp. 108-112, March 17-20, 1997.
14. C.S. Roumcnin, "Solid State Magnetic Sensors," Handbook of S&A, Elsevier 1994 (ISBN: 0 444 89401 2).
15. Ch.S. Roumenin, "Magnetic sensors continue to advance towards perfection," Sensors and Actuators A, vol.46-47, pp.273-279, 1995.
16. E. Donzier, O. Lefort, S. Spirkovitch, and F. Baillcu, "Integrated magnetic field sensor," Sensors and Actuators A, vol.25-27, pp.357-361, 1991.
17. Z. Kadar, A. Bossche, and J. Mollinger, "Integrated resonant magnetic-field sensor," Sensors and Actuators A, vol.41-42, pp.66-69, 1994.