Fault modeling of suspended thermal MEMS

IEEE International Test Conference (TC)

Volumn , Issue , 1999, Pages 319-328

  Charlot, B ^a   Mir, S ^a   Cota, E F ^a   Lubaszewski, M ^a   Courtois, B ^a  

^a TIMA LABORATORY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTER HARDWARE DESCRIPTION LANGUAGES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SCANNING ELECTRON MICROSCOPY; SCHEMATIC DIAGRAMS; SEMICONDUCTOR DEVICE MANUFACTURE;

BULK MICROMACHINING; ELECTROTHERMAL CONVERTER; FAULT INJECTION; FAULT MODELING; FAULT SIMULATION; REALISTIC DEFECTS; THERMAL MICROELECTROMECHANICAL SYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 0033316671     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)