Reliability assessment of a thin (flex) BGA using a polyimide tape substrate

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 207-213

  Thompson, Trent ^a   Carrasco, Armando ^a   Mawer, Andrew ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PLASTIC TAPES; POLYIMIDES;

BALL GRID ARRAYS (BGA);

ELECTRONICS PACKAGING;

EID: 0033313683     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)