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Volumn 49, Issue 1, 1999, Pages 17-26
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Packaging reliability
a |
Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
INTEGRATED CIRCUIT MANUFACTURE;
RELIABILITY;
VLSI CIRCUITS;
TIME TO MARKET;
MICROELECTRONICS;
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EID: 0033312365
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/S0167-9317(99)00426-8 Document Type: Article |
Times cited : (4)
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References (0)
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