Hybrid integrated 4x4 optical matrix switch module on silica based planar waveguide platform

IEICE Transactions on Electronics

Volumn E82-C, Issue 2, 1999, Pages 305-311

  Kato, Tomoaki ^a   Sasaki, Jun Ichi ^a   Shimoda, Tsuyoshi ^a   Hatakeyama, Hiroshi ^a   Tamanuki, Takemasa ^a   Kitamura, Shotaro ^a   Yamaguchi, Masayuki ^a   Sasaki, Tatsuya ^a   Komatsu, Keiro ^a   Kitamura, Mitsuhiro ^a   Itoh, Masataka ^a  

^a NEC CORPORATION   (Japan)

Author keywords

Flip chip bonding; Hybrid photonic integration; Optical fiber communication; Optical gate switch; Optical network; Optical switching; Photonic atm switch; Planar lightwave circuit; Semiconductor optical amplifier; Spot size conversion

Indexed keywords

ASYNCHRONOUS TRANSFER MODE; BONDING; DESIGN; ELECTRONICS PACKAGING; FIBER OPTIC NETWORKS; FLIP CHIP DEVICES; LIGHT AMPLIFIERS; MULTICHIP MODULES; OPTICAL COMMUNICATION; OPTICAL SWITCHES; OPTICAL WAVEGUIDES; SWITCHING SYSTEMS;

COUPLING LOSS; FLIP CHIP BONDING; HYBRID PHOTONIC INTEGRATED; OPTICAL GATE SWITCH; OPTICAL MODULES; PLANAR LIGHTWAVE CIRCUIT; SEMICONDUCTOR OPTICAL AMPLIFIERS; SILICA WAVEGUIDE; SPOT SIZE CONVERSION;

INTEGRATED OPTOELECTRONICS;

EID: 0033312308     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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