Temperature distributions in a stress-relief-type plate of functionally graded material under thermal shock

Journal of the Ceramic Society of Japan

Volumn 107, Issue 9, 1999, Pages 780-785

  Awaji, Hideo ^a   Takenaka, Hiromitsu ^a   Honda, Sawao ^a   Nishikawa, Tadahiro ^a  

^a NAGOYA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Alumina; Functionally graded materials; Nickel; Temperature distribution; Temperature dependent material property; Thermal shock

Indexed keywords

ALUMINA; COOLING; NICKEL; NUMERICAL ANALYSIS; STRESS RELIEF; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS; THERMAL GRADIENTS; THERMODYNAMIC PROPERTIES;

FUNCTIONALLY-GRADED MATERIALS (FGM); THERMAL SHOCK;

CERMETS;

EID: 0033311269     PISSN: 09145400     EISSN: None     Source Type: Journal    
DOI: 10.2109/jcersj.107.780     Document Type: Article

References (6)

1. The Society of Non-Traditional Technology, ed., "Functionally Gradient Materials," Kogyo-Chosa-Kai (1993) [in Japanese].
2. A. Ghosh, Y. Miyamoto, I. Reimais and J. J. Lannutti, ed., "Functionally Graded Materials," Am. Ceram. Soc., Westerville, Ohio (1997).
3. T. Nishikawa, S. Honda and M. Takatsu, 2nd Int. Meeting of Pacific Rim Ceramic Societies, 15-17 July, Cairns, Australia (1996).
4. N. Araki, A. Makino, T. Ishiguro and J. Mihara, Trans. Jpn. Soc. Mech. Eng., 57A, 4235-40 (1991) [in Japanese].
5. N. Araki, A. Makino, T. Ishiguro and J. Mihara, Int. J. Thermophysics, 13, 515-38 (1992).
6. Y. Sugano, K. Sato, N. Kimura and N. Sumi, J. Trans. Jpn. Soc. Mech. Eng., 62A, 728-36 (1996) [in Japanese].