Extrusion-spin coating: An efficient photoresist coating process for wafers

1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings

Volumn , Issue , 1999, Pages 245-248

  Derksen, J ^a   Han, Sangjun ^a   Chun, Jung Hoon ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COATING TECHNIQUES; DEFECTS; EFFICIENCY; EXTRUSION; MANUFACTURE; PHOTORESISTS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SILICON WAFERS; SPIN COATING; CRYSTAL DEFECTS;

COATING EFFICIENCY; COATING METHODS; COATING UNIFORMITY; CRITICAL DIMENSION; INDUSTRY STANDARDS; PHOTORESIST COATING; SEMI-CONDUCTOR WAFER; SPIN-COATING METHOD;

COATINGS; SEMICONDUCTOR DEVICE MANUFACTURE;

EXTRUSION-SPIN COATING; SEMICONDUCTOR WAFERS;

EID: 0033311168     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.1999.808782     Document Type: Conference Paper

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