Reliability testing of SnAgCu solder surface mount assembly

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 259-263

  Stam, F A ^a   Davitt, E ^a   Barrett, J ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CREEP; ELASTIC MODULI; FATIGUE OF MATERIALS; MECHANICAL VARIABLES MEASUREMENT; RELIABILITY; SOLDERING; SOLDERING ALLOYS; TESTING; THERMAL EFFECTS; TIN ALLOYS; YIELD STRESS;

CREEP RESISTANCE; LEAD FREE REFLOW SOLDERING; THERMAL SHOCK;

SURFACE MOUNT TECHNOLOGY;

EID: 0033310424     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)