Influence of different materials on the thermal behaviour of a CDIP-8 ceramic package

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3884, Issue , 1999, Pages 156-163

  Weide, Kirsten ^a   Keck, Christian ^a  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CERAMIC MATERIALS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT RESISTANCE; HEAT TRANSFER; MICROPROCESSOR CHIPS; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

CERAMIC PACKAGE; FINITE ELEMENT SIMULATION; THERMAL BEHAVIOR;

INTEGRATED CIRCUITS;

EID: 0033310279     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)