Mechanisms for microstructure evolution in electroplated copper thin films

Materials Research Society Symposium - Proceedings

Volumn 562, Issue , 1999, Pages 223-228

  Harper, J M E ^a   Cabral Jr , C ^a   Andricacos, P C ^a   Gignac, L ^a   Noyan, I C ^a   Rodbell, K P ^a   Hu, C K ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRON SCATTERING; ELECTROPLATED PRODUCTS; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HARDNESS; METALLIC FILMS; METALLOGRAPHIC MICROSTRUCTURE; TEXTURES; THIN FILMS;

CRYSTALLOGRAPHIC TEXTURE;

COPPER PLATING;

EID: 0033310161     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-562-223     Document Type: Conference Paper

References (22)