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Volumn 3874, Issue , 1999, Pages 218-226
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Deep anisotropic ICP plasma etching designed for high volume MEMS manufacturing
a a a a
a
USA
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
ASPECT RATIO;
AUTOMOBILE PARTS AND EQUIPMENT;
CMOS INTEGRATED CIRCUITS;
MASKS;
MICROMACHINING;
OXIDES;
PLASMA ETCHING;
RELIABILITY;
SENSORS;
SILICON ON INSULATOR TECHNOLOGY;
THROUGHPUT;
INDUCTIVE COUPLED PLASMA ETCHING;
MICROELECTROMECHANICAL SYSTEM MANUFACTURING;
MICROELECTROMECHANICAL DEVICES;
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EID: 0033309895
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (3)
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References (3)
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