Expediting ramp-to-volume production

IEEE International Test Conference (TC)

Volumn , Issue , 1999, Pages 103-112

  Balachandran, Hari ^a   Parker, Jason ^a   Gammie, Gordon ^a   Olson, John ^a   Force, Craig ^a   Butler, Kenneth M ^a   Jandhyala, Sri ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; DESIGN FOR TESTABILITY; FAILURE ANALYSIS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MICROPROCESSOR CHIPS; RELIABILITY; YIELD STRESS;

FAILURE SITE ISOLATION; RAMP TO VOLUME PRODUCTION;

INTEGRATED CIRCUIT TESTING;

EID: 0033308994     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)