Modeling of thermal expansion

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 236, Issue , 1999, Pages 77-85

  Rooney, Francis J ^a   Bechtel, Stephen E ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b OHIO STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENTROPY; MATHEMATICAL MODELS; PLASTIC DEFORMATION; TEMPERATURE; THERMOELASTICITY;

ENTROPY DEFORMATION CONSTRAINT; TEMPERATURE DEFORMATION CONSTRAINT; THERMOMECHANICAL CONSTRAINTS;

THERMAL EXPANSION;

EID: 0033300037     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (16)

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