Mechanical lapping of ultra-thin wafers for 3D integration

2000 22nd International Conference on Microelectronics, MIEL 2000 - Proceedings

Volumn 2, Issue , 1999, Pages 443-446

  Pinel, S ^a   Tasselli, J ^a   Bailbe, J P ^a   Marty, A ^a   Puech, P ^a   Esteve, D ^a  

^a LAAS CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; REACTIVE ION ETCHING; SEMICONDUCTOR MATERIALS; SILICON WAFERS; SUBSTRATES; ULTRATHIN FILMS;

KOH WET ETCHING; MECHANICAL LAPPING; ULTRA THIN WAFERS;

MULTICHIP MODULES;

EID: 0033297881     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/icmel.2000.838728     Document Type: Conference Paper

References (2)