Flexible circuitry - technology background and important fundamental issues

Circuit World

Volumn 25, Issue 2, 1999, Pages 6-10

  Fjelstad, Joseph ^a  

^a Tessera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC IMPEDANCE; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; PRINTED CIRCUIT BOARDS; TECHNOLOGY; THERMAL EXPANSION;

FLEXIBLE CIRCUIT; INTERCONNECTION TECHNOLOGY;

PRINTED CIRCUIT MANUFACTURE;

EID: 0033297871     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129910258207     Document Type: Article

References (0)