Interfacial debonding of an elliptical inhomogeneity in piezoelectric solids

Journal of Applied Mechanics, Transactions ASME

Volumn 66, Issue 4, 1999, Pages 1037-1040

  Deng, W ^a   Meguid, S A ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; INTERFACES (MATERIALS); PIEZOELECTRIC MATERIALS;

ELECTROSTATIC FIELD INTENSITY FACTORS; INTERFACIAL CURVILINEAR CRACKS; INTERFACIAL DEBONDING;

FRACTURE MECHANICS;

EID: 0033296520     PISSN: 00218936     EISSN: 15289036     Source Type: Journal    
DOI: 10.1115/1.2791779     Document Type: Article

References (5)

1. Deeg, W. F., 1980, “The Analysis of Dislocation, Crack, and Inclusion Problems in Piezoelectric Solids,” Ph.D. thesis, Stanford University, Stanford, CA.
2. Deng, W., and Meguid, S. A., 1999, “Closed Form Solutions for Partially Debonded Circular Inclusion in Piezoelectric Materials,” Acta. Mechanica, in press.
3. Gong, S. X., and Meguid, S. A., 1994, “On the Debonding of an Elastic Elliptical Inhomogeneity Under Antiplane Shear,” Int. J. Fracture, Vol. 67, pp. 37-52.
4. Pak, Y. E., 1990, “Crack Extension Force in a Piezoelectric Material,” ASME Journal of Applied Mechanics, Vol. 57, pp. 647-653.
5. Zhong, Z., and Meguid, S. A., 1997, “Interfacial Debonding of a Circular Inhomogeneity in Piezoelectric Materials,” Int. J. Solids Structures, Vol. 34, pp. 1965-1984.