Screen printing process design of experiments for fine line printing of thick film ceramic substrates

Journal of Electronics Manufacturing

Volumn 9, Issue 3, 1999, Pages 203-213

  Pan, Jianbiao ^a   Tonkay, Gregory L ^a   Quintero, Alejandro ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; DEPOSITION; ELECTRONICS PACKAGING; HARDNESS; NUMERICAL METHODS; PRINTED CIRCUIT DESIGN; QUALITY CONTROL; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THICK FILMS;

DESIGN OF EXPERIMENTS; FACTORIAL DESIGN; FINE LINE PRINTING; THICK FILM CERAMIC SUBSTRATES;

SCREEN PRINTING;

EID: 0033295124     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S096031319900012X     Document Type: Article

References (11)

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