Application of microwave heating for adhesive joining

American Society of Mechanical Engineers, Aerospace Division (Publication) AD

Volumn 58, Issue , 1999, Pages 89-94

  Thostenson, Erik T ^a   Chou, Tsu Wei ^a  

^a UNIVERSITY OF DELAWARE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE PASTES; COMPOSITE MATERIALS; CURING; HEAT TRANSFER; HIGH TEMPERATURE OPERATIONS; SHEAR STRENGTH; SUBSTRATES;

ELEVATED TEMPERATURE CURING; EPOXY PASTE ADHESIVE SYSTEM; THERMAL ENERGY;

MICROWAVE HEATING;

EID: 0033294074     PISSN: 07334230     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)

1. Don, R. C., S. H. McKnight, E. D. Wetzel, and J.W. Gillespie Jr., 1994, "Application of Thermoplastic Resistance Welding Techniques to Thermoset Composites," Proceedings of the 52nd Annual Technical Conference ANTEC 94, May 1-5, San Francisco, CA, Published by Society of Plastics Engineers.
2. Kamal, M. R. and S. Sourour, 1976, "DSC of Epoxy Cure: Isothermal Kinetics," Thermochemica Acta, Vol. 14, No. 1, 41-59.
3. rd, Baltimore, MD, on CD-ROM.
4. th annual meeting of the American Society for Composites (ASC), October 6-11, Dearborn, MI., 707-715.