Electromigration testing of via terminated test structures

Materials Research Society Symposium - Proceedings

Volumn 563, Issue , 1999, Pages 133-138

  Low, Kia Seng ^a   Poetzlberger, Hans ^a   O'Neill, Anthony ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b NEWCASTLE UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTROMIGRATION; METAL TESTING; STRESSES;

FOCUSED ION BEAMS (FIB); STRESS VOIDED LINES;

ELECTRIC CONTACTS;

EID: 0033285018     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-563-133     Document Type: Article

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