The thermomechanical behaviour of wood subject to fungal decay

Holzforschung

Volumn 53, Issue 5, 1999, Pages 459-464

  Birkinshaw, C ^a,b   McCarthy, C J ^a   Regan, N ^c   Hale, M D C ^b   Cahill, D ^a   McCourt, M ^b  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b BANGOR UNIVERSITY   (United Kingdom)

^c Forbairt   (Ireland)

Author keywords

Decay; Degradation; Dynamic mechanical analysis; Dynamic stiffness; Thermomechanical properties

Indexed keywords

BENDING STRENGTH; DECAY (ORGANIC); FUNGUS ATTACK; GAMMA RAYS; MATERIALS TESTING; RADIATION DAMAGE; STIFFNESS;

PICEA ABIES; PINUS SYLVESTRIS; THREE POINT BENDING TESTS;

WOOD;

EID: 0033284840     PISSN: 00183830     EISSN: None     Source Type: Journal    
DOI: 10.1515/HF.1999.076     Document Type: Article

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