Impact of test structure design on electromigration of metal interconnect

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 1999, Pages 39-43

  Qiang, Guo ^a   Foo, Lo Keng ^a   Xu, Zeng ^a   Pei, Yao ^a   Ping, Neo Soh ^a  

^a Chartered Semiconductor   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE MEASUREMENT; ELECTROMIGRATION;

HIGH RESOLUTION RESISTANCE MEASUREMENT (HRRM);

SEMICONDUCTOR DEVICE TESTING;

EID: 0033284760     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)