A detailed study of void motion in passivated aluminum interconnects

Materials Research Society Symposium - Proceedings

Volumn 563, Issue , 1999, Pages 103-108

  Doan, Jonathan C ^a   Bravman, John C ^a   Flinn, Paul A ^a   Marieb, Thomas N ^b  

^a Stanford University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTROMIGRATION; PASSIVATION;

ELECTROMIGRATION VOIDS;

ELECTRIC CONTACTS;

EID: 0033283653     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-563-103     Document Type: Article

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