Masking and etching of silicon and related materials for geometries down to 25 nm

IECON Proceedings (Industrial Electronics Conference)

Volumn 1, Issue , 1999, Pages 56-61

  Hilleringmann, U ^a   Vieregge, T ^a   Horstmann, J T ^a  

^a TU DORTMUND UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ANISOTROPY; CHEMICAL VAPOR DEPOSITION; DRY ETCHING; SILICON COMPOUNDS; SILICON WAFERS; TITANIUM NITRIDE; TUNGSTEN;

POLYSILICON;

NANOTECHNOLOGY;

EID: 0033282675     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)