Submicron CMOS thermal noise modeling from an RF perspective

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1999, Pages 151-152

  Ou, Jeffrey J ^a   Jin, Xiaodong ^a   Hu, Chenming ^a   Gray, Paul R ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; FREQUENCIES; MICROPROCESSOR CHIPS; THERMAL NOISE; VLSI CIRCUITS; WIRELESS TELECOMMUNICATION SYSTEMS;

PARAMETER EXTRACTION; SOFTWARE PACKAGE SPICE;

CMOS INTEGRATED CIRCUITS;

EID: 0033281314     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)