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Volumn , Issue , 1999, Pages 157-158
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Low-temperature metal/ON/HSG-cylinder capacitor process for high density embedded DRAMs
a a a a a a a a a a a
a
NEC CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
CAPACITORS;
CELLULAR ARRAYS;
ELECTRODES;
GRAIN SIZE AND SHAPE;
LOGIC DEVICES;
LOW TEMPERATURE OPERATIONS;
PHOSPHORUS;
SEMICONDUCTOR DOPING;
VLSI CIRCUITS;
HEMISPHERICAL GRAIN;
LOW TEMPERATURE CYLINDER CAPACITOR PROCESS;
DYNAMIC RANDOM ACCESS STORAGE;
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EID: 0033280129
PISSN: 07431562
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (5)
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References (1)
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