Growth and structure of metallic barrier layer and interconnect films I: Exeriments

Materials Research Society Symposium - Proceedings

Volumn 564, Issue , 1999, Pages 307-312

  Windt, D L ^a   Dalla Torre, J ^a,b   Gilmer, G H ^a   Sapjeta, J ^a   Kalyanaraman, R ^c   Baumann, F H ^a   O'Sullivan, P L ^a   Dunn, D ^d   Hull, R ^d  

^a LUCENT TECHNOLOGIES   (United States)

^b LAAS CNRS   (France)

^c OAK RIDGE NATIONAL LABORATORY   (United States)

^d University of Virginia   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ATOMIC FORCE MICROSCOPY; COMPUTER SIMULATION; COPPER; FILM GROWTH; METALLIC FILMS; SURFACE ROUGHNESS; TANTALUM; THIN FILMS; TITANIUM; X RAY ANALYSIS;

METALLIC BARRIER LAYERS; X RAY REFLECTANCE ANALYSIS;

ELECTRIC CONTACTS;

EID: 0033279481     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-562-263     Document Type: Article

References (11)

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4. Note, however, that for thicker films, the amplitude of the oscillations are also reduced as a result of the finite instrumental angular resolution.
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