Correlation between agglomeration of a thin film and reflow filling in a contact hole for sputtered Al films

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 6, 1999, Pages 2553-2558

  Shingubara, S ^a   Kotani, H ^a   Sakaue, H ^a   Nishiyama, F ^a   Takahagi, T ^a  

^a HIROSHIMA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0033261751     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.591126     Document Type: Article

References (23)

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