Laser sintering of Cu-Sn-C system P/M alloys

Journal of Materials Science

Volumn 34, Issue 21, 1999, Pages 5403-5406

  Zuoxing, Guo ^a   Jiandong, Hu ^a   Zhenfeng, Zhou ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPACTION; DENSITY (SPECIFIC GRAVITY); FRACTURE TOUGHNESS; HARDNESS; HIGH TEMPERATURE OPERATIONS; INTERMETALLICS; LASER APPLICATIONS; POWDER METALLURGY; SINTERING; THERMAL CYCLING; THERMOCOUPLES; WEAR RESISTANCE;

GREEN COMPACT LASER SINTERING; SIMULATION DIFFUSION COUPLE;

COPPER ALLOYS;

EID: 0033225139     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004781929680     Document Type: Article

References (5)

1. NARENDRA N. ACHARGA and PUDUKOTTAH G. MUKUNDA, The International Journal of Powder Metallurgy 31 (1995) 63.
2. J. W. KIM, S. J. L. KANG and D. N. YOON, Powder Metallurgy International 19 (1987) 41.
3. HU JIANDONG and LI ZHANG, in "Invention Patent Bulletin," edited by Chinese National Patent Bureau (Beijing, China, 1992) p. 15.
4. HU JIANDONG, LI YULONG, LI ZHANG, BU XIANZHANG and WANG LICHUN, J. Mater. Sci. 28 (1993) 796.
5. HU JIANDONG, GUO ZOUXING GUAN QINGFENG and LI YULONG, Optics and Laser Technology 29 (1997) 75.