Functionalized polynorbornene dielectric polymers: adhesion and mechanical properties

Journal of Polymer Science, Part B: Polymer Physics

Volumn 37, Issue 21, 1999, Pages 3003-3010

  Grove, Nicole R ^a   Kohl, Paul A ^b   Bidstrup Allen, Sue Ann ^b   Jayaraman, Saikumar ^c   Shick, Robert ^c  

^a MOTOROLA INC   (United States)

^b Georgia Institute of Technology   (United States)

^c GOODRICH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ADHESION; DIELECTRIC MATERIALS; ELASTIC MODULI; ELECTRONICS PACKAGING; FREE RADICALS; MECHANICAL PROPERTIES; ORGANIC COMPOUNDS; PERMITTIVITY; RESIDUAL STRESSES; SUBSTRATES; THERMAL EXPANSION;

ALKYL GROUPS; ELONGATION TO BREAK VALUES; POLARITY; POLYMER BACKBONE; POLYNORBORNENE DIELECTRIC POLYMERS; TRIETHOXYSILYL GROUPS;

ORGANIC POLYMERS;

EID: 0033224977     PISSN: 08876266     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-0488(19991101)37:21<3003::AID-POLB10>3.0.CO;2-T     Document Type: Article

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