Electromigration performance of Al-Si-Cu filled vias with titanium glue layer

Microelectronics Reliability

Volumn 39, Issue 11, 1999, Pages 1697-1706

  Kageyama, M ^a   Hashimoto, K ^a   Onoda, H ^a  

^a OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; ELECTRIC CONTACTS; ELECTROMIGRATION; GLUES; TITANIUM;

ELECTROMIGRATION LIFETIME;

MICROELECTRONICS;

EID: 0033221739     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(99)00175-4     Document Type: Article

References (13)

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