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Volumn 69, Issue 5, 1999, Pages 441-449

Stress-relaxing composite ligature wires: Formulations and characteristics

Author keywords

Composite; Ligature; Mechanical properties; Stress relaxation

Indexed keywords

BENZOIN; BISPHENOL A BIS(2 HYDROXYPROPYL) ETHER DIMETHACRYLATE; ETHER DERIVATIVE; MACROGOL DERIVATIVE; METHACRYLIC ACID BUTYL ESTER; METHACRYLIC ACID DERIVATIVE; POLYBUTYL METHACRYLATE; POLYETHYLENE DERIVATIVE; POLYMER; POLYMETHACRYLIC ACID DERIVATIVE; RESIN; STAINLESS STEEL; TRIETHYLENE GLYCOL DIMETHACRYLATE; ULTRA HIGH MOLECULAR WEIGHT POLYETHYLENE; ULTRA-HIGH MOLECULAR WEIGHT POLYETHYLENE;

EID: 0033208793     PISSN: 00033219     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (7)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.