The grain shape dependence of springback of integrated circuit leadframes

Materials Science and Engineering: A

Volumn 270, Issue 2, 1999, Pages 323-329

  Chan, K C ^a   Wang, S H ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Anisotropy; Copper alloy; Springback

Indexed keywords

ANISOTROPY; BENDING (DEFORMATION); COLD ROLLING; CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; GRAIN SIZE AND SHAPE; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; POLYCRYSTALS; SHEET METAL; TEXTURES;

FULL CONSTRAINT MODEL; LEADFRAMES; PLASTIC ANISOTROPY; RELAXED CONSTRAINT MODEL; SPRINGBACK;

COPPER ALLOYS;

EID: 0033189608     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(99)00256-7     Document Type: Article

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