Electrode attachment, aging and thermal-cycling characteristics of yttria-based thermistors

Materials Letters

Volumn 40, Issue 5, 1999, Pages 213-221

  Holt, C ^a   Rahman, M ^a   Akbar, S A ^a   Bulusu, P ^a   Wang, C C ^a  

^a Department of Medicine   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BONDING; DEGRADATION; DIFFUSION; ELECTROCHEMICAL ELECTRODES; MATERIALS TESTING; MICROCRACKS; MICROSTRUCTURE; SOLID STATE PHYSICS; THERMAL CYCLING; THERMISTORS; THERMODYNAMIC STABILITY;

ELECTRODE ATTACHMENT; LEAD WIRE ATTACHMENT METHOD; MELTING POINT; SOLID STATE DIFFUSION BONDING;

YTTRIUM COMPOUNDS;

EID: 0033189337     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(99)00078-6     Document Type: Article

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