Influence of microstructure and temperature on the interfacial fracture energy of silicon nitride/boron nitride fibrous monolithic ceramics

Journal of the American Ceramic Society

Volumn 82, Issue 9, 1999, Pages 2502-2508

  Trice, Rodney W ^a,b   Halloran, John W ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BORON COMPOUNDS; CRACK PROPAGATION; HOT PRESSING; INTERFACIAL ENERGY; MICROCRACKS; MICROSTRUCTURE; PEELING; SILICON NITRIDE; TEMPERATURE;

BORON NITRIDE; CHARALAMBIDES; FIBROUS MONOLITHIC CERAMICS; INTERFACIAL FRACTURE ENERGY;

CERAMIC FIBERS;

EID: 0033188958     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.1999.tb02110.x     Document Type: Article

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