Influence of microwave plasma treatment on the wettability and the adhesive properties of polyamides films with an epoxy resin

International Journal of Adhesion and Adhesives

Volumn 19, Issue 4, 1999, Pages 273-279

  Lennon, P ^a,b   Espuche, E ^a   Sautereau, H ^b   Sage, D ^a  

^a UNIVERSITÉ LYON 1   (France)

^b UNIVERSITÉ DE LYON   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMMONIA; BOND STRENGTH (MATERIALS); CHEMICAL MODIFICATION; EPOXY RESINS; NITROGEN; OXYGEN; PLASMA APPLICATIONS; PLASTIC ADHESIVES; POLYAMIDES; SURFACE TREATMENT; WETTING;

MICROWAVE PLASMA TREATMENT; WETTABILITY;

PLASTIC FILMS;

EID: 0033177479     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(98)00070-0     Document Type: Article

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