Nanoscale analysis of multilayer interfaces of W/Al2O3/Ti/Cu

Interface Science

Volumn 7, Issue 2, 1999, Pages 191-196

  Ohta, S ^a   Gotoh, D ^a   Sakaguchi, N ^a   Takahashi, H ^a  

^a HOKKAIDO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINA; ANNEALING; COPPER; DIFFUSION IN SOLIDS; MAGNETRON SPUTTERING; MULTILAYERS; NANOSTRUCTURED MATERIALS; THIN FILMS; TITANIUM; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

ALUMINA FILM; COPPER FILM; FILM THICKNESS; FOCUSED ION BEAM; NANOSCALE ANALYSIS; TITANIUM FILM; TUNGSTEN FILM;

INTERFACES (MATERIALS);

EID: 0033171676     PISSN: 09277056     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008744021170     Document Type: Article

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