Optimization of via connections between transmission lines in multilayer LTCC-modules

Advancing Microelectronics

Volumn 26, Issue 4, 1999, Pages 19-23

  Thelemann, Torsten ^a   Thust, Heiko ^a   Lingel, Thomas ^a  

^a ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELECTRIC IMPEDANCE; MULTILAYERS; OPTIMIZATION; PRECISION ENGINEERING;

LOW TEMPERATURE COFIRED CERAMICS (LTCC); MULTILAYER CERAMICS;

MICROELECTRONICS;

EID: 0033164762     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)