Stress-strain analysis of a taper-taper adhesive-bonded joint under cylindrical bending

Journal of Engineering Materials and Technology, Transactions of the ASME

Volumn 121, Issue 3, 1999, Pages 374-380

  Helms, Jack E ^a   Yang, Chihdar ^b   Pang, Su Seng ^c  

^a Albemarle Corporation   (United States)

^b Wichita State University   (United States)

^c LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CYLINDRICAL BENDING; FIRST ORDER LAMINATED PLATE THEORY; LINEAR SHOOTING METHOD; SHEAR CORRECTION FACTORS; STRESS STRAIN ANALYSIS; TAPER-TAPER ADHESIVE BONDED JOINT; VARIABLE COEFFICIENTS;

BENDING (DEFORMATION); DIFFERENTIAL EQUATIONS; FINITE ELEMENT METHOD; FORTRAN (PROGRAMMING LANGUAGE); MATHEMATICAL MODELS; SHEAR DEFORMATION; STRAIN; STRESS CONCENTRATION; STRESSES;

ADHESIVE JOINTS;

EID: 0033164510     PISSN: 00944289     EISSN: 15288889     Source Type: Journal    
DOI: 10.1115/1.2812389     Document Type: Article

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